Samsung's upcoming flagship chipset, the Exynos 2700, is set to undergo a significant redesign, as recent reports suggest the company will move away from Fan-Out Wafer-Level Packaging (FOWLP) technology for this new SoC.
FOWLP, employed by Samsung since the Exynos 2400, has been credited with enhancing thermal performance. However, the technology's complex and costly manufacturing process has made it less profitable for the company.
According to an industry official, Samsung intends to implement a new packaging architecture for the Exynos 2700 known as Side-by-Side (SbS). In this arrangement, the application processor (AP) and DRAM will be positioned adjacent to each other on the substrate, rather than in a stacked configuration.
Additionally, the company is expected to integrate its Heat Pass Block (HPB) technology into the Exynos 2700, which is anticipated to enhance heat dissipation and overall thermal efficiency.
Samsung plans to incorporate the Exynos 2700 in the Galaxy S27 and Galaxy S27+, both scheduled for release in early 2027. Observing the effects of the chipset's new packaging design on thermal performance and efficiency will be particularly intriguing.
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