Xiaomi 18 Fold Launch Set for September, Showcasing the Impressive Xring O3 Chipset

Xiaomi is gearing up for the launch of its next foldable smartphone, the Xiaomi 18 Fold, which is officially set to debut in September. Breaking away from the previous naming convention, this new device will feature the cutting-edge Xring O3 chipset, a significant upgrade from last year's Xring O1.

The Xring O3 chipset has already made waves in the performance arena, achieving a remarkable 5,228,014 points in the AnTuTu V11 benchmark, surpassing all other smartphone SoCs currently available.

Equipped with a deca-core CPU, the Xring O3 includes two C1-Ultra cores running at frequencies of up to 4.35GHz, four C1-Premium cores up to 3.68GHz, and four C1-Pro cores reaching up to 3.15GHz.

In Geekbench 6.5, the Xring O3 secures an impressive 3,945 single-core score and a 15,221 multi-core score. While the Apple A19 Pro holds an edge in single-core performance, it falls significantly short in multi-core capabilities when compared to the Xring O3.

In various benchmarks, the GPU of the Xring O3 has demonstrated improvements of 85%, 94%, and even 182% over its predecessor, the Xring O1. This new chipset also outperforms the Apple A19 Pro in all the benchmarks that Xiaomi has released so far. In addition, the Xring O3 supports LPDDR6 RAM with an impressive bandwidth of 113.8GB/s.

Overall, Xiaomi's latest self-developed chipset, the Xring O3, appears to have matured significantly and is set to emerge as a formidable contender against the leading offerings from Qualcomm, MediaTek, and Apple.

Source