MediaTek is set to launch its flagship Dimensity 9600 SoC later this year, but the company is also developing the Dimensity 8600, an upper-midrange SoC. This is significant as MediaTek's Dimensity 8 series has recently dominated AnTuTu benchmark ratings for upper-midrange devices, seemingly allowing Qualcomm to cede this market to MediaTek.
The upcoming Dimensity 8600 is generating interest due to its potential enhancements. Recent rumors from China suggest that this chip will utilize a 3nm manufacturing process, an improvement over the 4nm process used for the Dimensity 8500.
Moreover, the 8600 is said to feature a "completely upgraded architecture," although details remain scarce. The Dimensity 8 series has gained attention for its all-big-core design, leading to speculation about potential upgrades to the cores. However, it remains to be seen whether a Prime core will be included, given the cost efficiency expected from this platform.
Currently, devices from Oppo, vivo, and their sub-brands are undergoing testing with the Dimensity 8600 chipset, with anticipated launches by year-end, some of which may feature impressive 10,000 mAh batteries.
Source (in Chinese)
