The latest from Honor has generated excitement as the Honor Magic9 Pro Max has been spotted in the Geekbench online database, showcasing its impressive specifications. With the model number WKL-AN20, this flagship device is set to make waves with its powerful chipset and abundant RAM.
The Geekbench listing reveals that the Honor Magic9 Pro Max is powered by the Snapdragon 8 Elite Gen 6 chipset, although the specific variant remains unnamed. The prototype that underwent testing boasts a remarkable 16GB of RAM and is expected to launch with Android 17. However, it's worth noting that additional RAM configurations might be available at launch. It is also important to mention that these results come from a prototype device that may not feature the finalized hardware and software. Moreover, the testing took place using Geekbench version 6.7.1, meaning the results are not directly comparable to those from the more recent Geekbench 7.
The much-anticipated Honor Magic9 series is set to be officially unveiled on September 28. The Pro Max model will be the flagship of the lineup, featuring a high-end camera system co-branded with ARRI. It will include a remarkable 200MP main camera that utilizes a 1/1.28" type sensor, as well as a 200MP periscope telephoto camera with a 1/1.4" type sensor. Additionally, an ultrawide camera is also expected to be included.
On the selfie front, the device will use Honor's distinctive 3D face unlocking technology, and it has been rumored that it will feature a square selfie sensor. The Honor Magic9 Pro Max will debut with Honor's upcoming MagicOS 11, promising an exciting user experience.
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