A recent report from China indicates that Google’s upcoming Tensor G6 chipset, set to debut in the Pixel 11 series, will be the first smartphone chip manufactured using TSMC’s cutting-edge 2nm process. This advancement places Google ahead of competitors such as Qualcomm, MediaTek, and Apple, whose respective chips—Snapdragon 8 Elite Gen 6, Dimensity 9600, and A20 Pro—are expected to be unveiled later in September. Google has already scheduled the unveiling of the Pixel 11 family for August 12.
Furthermore, an FCC filing for the Pixel 11 Pro Fold has confirmed earlier rumors that Google is transitioning from Samsung’s Exynos modem line to MediaTek’s M90 modem for its next-generation Pixel devices. The new modem will support impressive 5G speeds of up to 12 Gbps, along with satellite connectivity and dual-active 5G SIM capabilities.
This transition suggests that Pixel 11 devices will deliver improved and more reliable connectivity compared to their predecessors, which relied on Samsung modems.
Source 1 (in Chinese) | Source 2
