Last month, analyst Ming-Chi Kuo reported that OpenAI was developing an AI-agent smartphone, originally slated for mass production in 2028. Now, Kuo suggests that the timeline may be moving closer, sharing early specifications of the device.
According to Kuo, the OpenAI smartphone is now expected to enter mass production in the first half of 2027. This acceleration is attributed to the burgeoning AI phone market and a potential year-end initial public offering (IPO).
Ming-Chi Kuo also revealed key specifications for OpenAI's smartphone. MediaTek is likely to be the exclusive supplier of the system-on-chip (SoC), with the device expected to feature a customized Dimensity 9600 chipset, built on TSMC's N2P process.
Kuo noted that imaging capabilities will be a significant focus, with the image signal processor (ISP) featuring an enhanced high dynamic range (HDR) pipeline aimed at improving real-world visual capture.
The OpenAI phone is reported to include a dual-NPU architecture to handle AI workloads, along with LPDDR6 RAM and UFS 5.0 storage. In terms of security, it is expected to support pKVM and inline hashing.
If development remains on track, Kuo estimates that total shipments could reach 30 million units in 2027 and 2028.
