MediaTek has launched the successors to last year's Dimensity 7400 and 7400X chipsets. While these new models, Dimensity 7450 and Dimensity 7450X, represent a modest refresh rather than a full generational upgrade, their names suggest this incremental evolution.
There are no CPU enhancements, as both chipsets continue to utilize the same octa-core configuration: 4 Cortex-A78 cores clocked at 2.6 GHz and 4 Cortex-A55 cores at 2.0 GHz. The GPU remains the Mali-G615 MC2.
MediaTek has noted a 7% increase in AI processing power, particularly benefiting photography-related tasks.
The primary advancements in these new SoCs revolve around connectivity. The Dimensity 7450 and 7450X are equipped with the upgraded 5G R17 modem, replacing the R16 from their predecessors. This new modem offers enhanced power efficiency, improved performance through 3CC carrier aggregation, and a 20% boost in performance during transit. Additionally, these chips are designed to quickly restore network connections after leaving a dead zone.
What distinguishes the Dimensity 7450 from the Dimensity 7450X? The 7450X supports dual-display configurations, making it suitable for budget-friendly foldable smartphones.
The first devices featuring these SoCs are expected to enter the market in the coming months.
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