The Taiwan Semiconductor Manufacturing Company (TSMC) experienced an earthquake affecting its facilities situated in the Hsinchu Science Park, Taiwan, on December 27, 2025. The seismic event was significant enough to trigger safety protocols and evacuations at the site.
TSMC Confirms Earthquake Impact at Hsinchu Site
TSMC confirmed that the earthquake, which occurred approximately 20 miles (32 kilometers) off the coast of Yilan, Taiwan, caused disruption at its Hsinchu Science Park facilities. The earthquake registered a magnitude of about 7.0 on the Richter scale, with a depth near 45 miles (73 kilometers).
Safety Measures and Evacuations Implemented
Image credit — Flickr
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Minimal Disruption to Production Operations
Despite the earthquake, TSMC’s operations, including the production of chips such as the 2 nm Exynos 2600, continue largely unaffected with new orders for its foundry steadily arriving.
